We are pleased to announce the Call for Papers for NexSymp Summit 2026, a premier virtual international symposium co-organised by Journal od Engineering and Technology (JETAP), showcasing cutting‑edge research and innovation across disciplines.

This virtual conference will be held on 29 & 30 September 2026, and there's No registration fee for publication with MMU Press. Accepted manuscript will be published in Journal of Engineering Technology and Applied Physics, JETAP (indexed by MyCite and DOAJ) with No publication fee.

For registration and manuscript submission, please visit the following website (select NexSymp2026_STERO_JETAP) Journal of Engineering Technology and Applied Physics   Full paper submission deadline: 1 June 2026.   or more information on NexSymp 2026, please visit this website: NexSymp 2026 - MMU Press