Effect of Laminating Press’s Opening-Stacking Position on Adhesive Thickness in Coverlay/Adhesive/Flexible-Printed-Circuit Sheet

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Published: Jun 19, 2019
DOI: https://doi.org/10.33093/jetap.2019.1.1.10
Keywords:
Flexible electronics, adhesive layer, flexible printed circuit, Adhesive, copper clad laminate

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Kok Tee Lau
Fakulti Teknologi Kejuruteraan Mekanikal dan Pembuatan, Universiti Teknikal Malaysia Melaka
Hoi Ern Kok
Fakulti Teknologi Kejuruteraan Mekanikal dan Pembuatan, Universiti Teknikal Malaysia Melaka
Hairul Effendy Bin Ab Maulod
Fakulti Teknologi Kejuruteraan Mekanikal dan Pembuatan, Universiti Teknikal Malaysia Melaka
Nurizzatul Zahirah Binti Abdul Latiff
Fakulti Teknologi Kejuruteraan Mekanikal dan Pembuatan, Universiti Teknikal Malaysia Melaka
Aida Nazifa Binti Abdul Aziz
Fakulti Teknologi Kejuruteraan Mekanikal dan Pembuatan, Universiti Teknikal Malaysia Melaka
Nur Hazirah Binti Rosli
MFS Technology (M) Sdn. Bhd.

Abstract

This study is to investigate the dependence of coverlay’s adhesive thickness on the laminating press’s opening-stacking position. Coverlays using acrylic- and epoxy-based adhesives were laminated onto similar size copper clad laminate (CCL) at 140 bars and 195°C for 150 min. Adhesive thickness measurements show opening-stacking positions near to the bottom of laminating press machine produced more consistent adhesive thickness as compared to the top positions.

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Vol. 1 No. 1 (2019): https://doi.org/10.33093/jetap.2019.1.1
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Articles
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This work is licensed under a Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.

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