JEEVAN KANESALINGAM; SEE FUNG LEE; HOCK GUAN HO. Study of Temperature Measurement Accuracy by Using Different Mounting Adhesives. Journal of Engineering Technology and Applied Physics, [S. l.], v. 2, n. 2, p. 24–27, 2020. DOI: 10.33093/jetap.2020.2.2.4. Disponível em: https://journals.mmupress.com/index.php/jetap/article/view/100. Acesso em: 21 apr. 2025.