LOH, Siu Hong; TEH, Peh Chiong; SIM, Jia Jia; YEAP, Kim Ho; LEE, Yong Kang. Integrated Circuit Packaging Recognition with Tilt Auto Adjustment using Deep Learning Approach. Journal of Engineering Technology and Applied Physics, [S. l.], v. 5, n. 2, p. 79–84, 2023. DOI: 10.33093/jetap.2023.5.2.9. Disponível em: https://journals.mmupress.com/index.php/jetap/article/view/568. Acesso em: 7 jun. 2026.