SOOSAI, Terence; MHD NOOR, Ervina Efzan; BAIG, Mirza Farrukh; AKSO, Canan. Effects of Composition and Processing on the Properties of Sn-3Zn-4Bi and Sn-Ag-Cu Solder Alloys for Electronic Packaging. International Journal on Robotics, Automation and Sciences, [S. l.], v. 7, n. 3, p. 1–7, 2025. DOI: 10.33093/ijoras.2025.7.3.1. Disponível em: https://journals.mmupress.com/index.php/ijoras/article/view/2403. Acesso em: 14 jun. 2026.